Features

1. Compact sized, low profile type with 3.9mmx2.9mm outline dimensions and a 1.5mm to 2.0mm height.
2. Small size improves the mounting density of components on the PC board.
3. Reflow solderable.
4. Packaged with a 12mm wide embossed taping.
5. 0.13 Travel.

Applications

1. Portable audio.
2. Cellular phones and personal digital assistances.
3. Keyless entry system.
4. Operations of various digital devices.